IC structure with adjustable inductance and capacitance and related method

Embodiments of the present disclosure provide an integrated circuit (IC) structure including: a first conductive layer of a device structure; a second conductive layer of the device structure vertically separated from the first conductive layer, wherein a load resistor couples the second conductive...

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Bibliographische Detailangaben
Hauptverfasser: Vanukuru, Venkata N. R, Shukla, Umesh Kumar, Torgal, Sandeep
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Embodiments of the present disclosure provide an integrated circuit (IC) structure including: a first conductive layer of a device structure; a second conductive layer of the device structure vertically separated from the first conductive layer, wherein a load resistor couples the second conductive layer to ground; a t-coil having a first end coupled to the first conductive layer, and a second end coupled to the second conductive layer; and a variable capacitor having a first end coupled to the first conductive layer, and a second end coupled to the second conductive layer, the variable capacitor having an adjustable capacitance.