Systems, methods and apparatus for post-chemical mechanical planarization substrate buff pre-cleaning

Systems, methods and apparatus for post-chemical mechanical planarization substrate buff pre-cleaning

In some embodiments, an apparatus for cleaning a substrate is provided that includes (1) a substrate chuck configured to support a substrate with a front side of the substrate accessible; (2) a buff pad assembly configured to support a buff pad having a diameter smaller than a diameter of the substr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Chen, Hui, Brown, Brian J, Ding, Yunshuang, Atkinson, Jim K, Tang, Jianshe, Chen, Yufei, Sakata, Clinton P
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
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Beschreibung
Zusammenfassung:In some embodiments, an apparatus for cleaning a substrate is provided that includes (1) a substrate chuck configured to support a substrate with a front side of the substrate accessible; (2) a buff pad assembly configured to support a buff pad having a diameter smaller than a diameter of the substrate; and (3) a swing arm coupled to the buff pad and configured to position and rotate the buff pad along the front side of the substrate, and control an amount of force applied by the buff pad against the front side of the substrate during cleaning. The substrate chuck, buff pad assembly and swing arm are configured to buff clean the substrate. Numerous additional aspects are disclosed.