Waterborne curing compositions for electrodeposition and radiation curing

The present invention relates to waterborne curing compositions for electrodeposition and radiation curing and processes to obtain such compositions. The compositions are characterized in that an ethylenically unsaturated compound (b), is dispersed in an aqueous solution by an at least partially neu...

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Bibliographische Detailangaben
Hauptverfasser:	Paar, Willibald, Peeters, Stephan, Tielemans, Michel
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES APPARATUS THEREFOR CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The present invention relates to waterborne curing compositions for electrodeposition and radiation curing and processes to obtain such compositions. The compositions are characterized in that an ethylenically unsaturated compound (b), is dispersed in an aqueous solution by an at least partially neutralized (meth)acrylic modified amine epoxy adduct. The compositions of the invention are particularly suitable for coating metallic materials and temperature sensitive materials such as electrically conductive plastic materials.