Cooling device for electronic components using liquid coolant
A device used for cooling a component including a support to receive a component to be cooled, is provided. The support includes a fluid network in which a liquid will circulate. The network includes a first cavity, a second cavity, and a first channel connecting the first cavity to the second cavit...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A device used for cooling a component including a support to receive a component to be cooled, is provided. The support includes a fluid network in which a liquid will circulate. The network includes a first cavity, a second cavity, and a first channel connecting the first cavity to the second cavity, a first deformable membrane and a second deformable membrane forming a mobile wall of the first cavity and a mobile wall of the second cavity respectively. The device further an actuation device for actuating the first membrane and the second membrane, the actuating device including a fixed electrode located on one or several protuberances of the support. |
---|