Semiconductor apparatus, stack semiconductor apparatus, and test method of the stack semiconductor apparatus

A semiconductor apparatus includes two or more semiconductor chips and a tester. The two or more semiconductor chips are electrically connected through one or more through-silicon vias (TSVs). The tester is on at least one of the two or more semiconductor chips and tests the state of at least one TS...

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Bibliographische Detailangaben
Hauptverfasser: Woo, Seung-han, Oh, Reum, Lee, Hae-suk
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A semiconductor apparatus includes two or more semiconductor chips and a tester. The two or more semiconductor chips are electrically connected through one or more through-silicon vias (TSVs). The tester is on at least one of the two or more semiconductor chips and tests the state of at least one TSV based on an output signal of the TSV. The TSV is selected as a signal transmission TSV based on the state of the TSV.