Methods of forming trenches in packages structures and structures formed thereby

Methods of forming a package structures comprising a trench are described. An embodiment includes a first die disposed on a first substrate, and at least one interconnect structure disposed on a peripheral region of the first substrate. A molding compound is disposed on a portion of the first substr...

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Bibliographische Detailangaben
Hauptverfasser:	Raghavan, Prasanna, Fei, Huiyang, Malatkar, Pramod, Yagnamurthy, Naga Sivakumar, Nickerson, Robert
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS INFORMATION STORAGE MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS STATIC STORES TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	Methods of forming a package structures comprising a trench are described. An embodiment includes a first die disposed on a first substrate, and at least one interconnect structure disposed on a peripheral region of the first substrate. A molding compound is disposed on a portion of the first substrate and on the first die, wherein a trench opening is disposed in the molding compound that is located between the at least one interconnect structure and the first die.