Electronic device

Disclosed are various embodiments related to a bonding member that bonds components of an electronic device. An electronic device may include a tape member that include: a first bonding layer and a second bonding layer. One of the first bonding layer and the second bonding layer comprises a material...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Kim, Yong-Beom, Park, Sin-Young, Jung, Bo-Won
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS PHYSICS TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Disclosed are various embodiments related to a bonding member that bonds components of an electronic device. An electronic device may include a tape member that include: a first bonding layer and a second bonding layer. One of the first bonding layer and the second bonding layer comprises a material having a bonding force in a selected range in a predetermined temperature range.