Vacuum package, electronic device, and vehicle

Vacuum package, electronic device, and vehicle

A vacuum package includes a substrate, a pair of through electrodes that penetrates the substrate, each of the pair of the trough electrodes having first end portion, and a getter that is joined to the first end portions of the pair of the through electrodes, and is heated by electronic conduction v...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Kawai, Hiromu
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Beschreibung
Zusammenfassung:A vacuum package includes a substrate, a pair of through electrodes that penetrates the substrate, each of the pair of the trough electrodes having first end portion, and a getter that is joined to the first end portions of the pair of the through electrodes, and is heated by electronic conduction via the pair of the through electrodes A portion of the getter between the through electrodes is spaced apart from the substrate.