Conductive structure and method for manufacturing conductive structure

A conductive structure includes a substrate including a first dielectric layer formed thereon, at least a first opening formed in the first dielectric layer, a low resistive layer formed in the opening, and a first metal bulk formed on the lower resistive layer in the opening. The first metal bulk d...

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Bibliographische Detailangaben
Hauptverfasser: Chiu, Chun-Chieh, Yi, Yen-Tsai, Tsai, Min-Chuan, Chen, Li-Han, Huang, Hsin-Fu, Tsai, Wei-Chuan
Format: Patent
Sprache:eng
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Zusammenfassung:A conductive structure includes a substrate including a first dielectric layer formed thereon, at least a first opening formed in the first dielectric layer, a low resistive layer formed in the opening, and a first metal bulk formed on the lower resistive layer in the opening. The first metal bulk directly contacts a surface of the first low resistive layer. The low resistive layer includes a carbonitride of a first metal material, and the first metal bulk includes the first metal material.