Method for the new production of through holes in a layer system

Introducing a through hole into a substrate (4) before coating, and performing the removal thereafter, shortens the machining times for producing a through hole (18) with a diffuser (13) and also subjects the intermediate layers to less stress.

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Bibliographische Detailangaben
Hauptverfasser:	Massa, Andrea, Wilkenhöner, Rolf, Felkel, Diana, Wollnik, Adrian, Basdere, Bahadir
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ENGINE PLANTS IN GENERAL HEATING LIGHTING MACHINE TOOLS MACHINES OR ENGINES IN GENERAL MECHANICAL ENGINEERING METAL-WORKING NOT OTHERWISE PROVIDED FOR NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAMTURBINES PERFORMING OPERATIONS SOLDERING OR UNSOLDERING STEAM ENGINES TRANSPORTING WEAPONS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Introducing a through hole into a substrate (4) before coating, and performing the removal thereafter, shortens the machining times for producing a through hole (18) with a diffuser (13) and also subjects the intermediate layers to less stress.