Composition for blackening copper-based or silver-based metals

The present invention addresses the problem of providing a new composition for blackening that, without compromising the smoothness of copper-based or silver-based metals, allows for sufficient blackening of copper circuits of printed wiring boards, circuits formed by silver paste, and products cont...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Kita, Azusa, Kang, Joonhaeng, Sakai, Hiroaki
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention addresses the problem of providing a new composition for blackening that, without compromising the smoothness of copper-based or silver-based metals, allows for sufficient blackening of copper circuits of printed wiring boards, circuits formed by silver paste, and products containing copper-based or silver-based metals, such as other various kinds of copper, copper alloys, silver, and silver alloys. The present invention provides a composition for blackening copper-based or silver-based metals, said composition comprising an aqueous solution containing (i) at least one water-soluble metal compound selected from the group consisting of water-soluble palladium compounds, water-soluble ruthenium compounds, and water-soluble silver compounds; (ii) at least one halide selected from the group consisting of hydrohalic acids, metal halides, and ammonium halides; and (iii) at least one nitrogen atom-containing compound selected from the group consisting of alkylene diamines, polyalkylene polyamines, polyamide polyamines, and cross-linked polyamide polyamines.