Apparatus and method of tunable heat sink

Apparatus and method of tunable heat sink

A first surface of a heat source is spaced from a support by a first gap, in a thermal path from the first surface to the support. A second surface of the heat source, opposite to the first surface, is spaced by a second gap from a heat sink, in a thermal path from the second surface to the heat sin...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Nikkhoo, Michael, Hurbi, Erin Elizabeth
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A first surface of a heat source is spaced from a support by a first gap, in a thermal path from the first surface to the support. A second surface of the heat source, opposite to the first surface, is spaced by a second gap from a heat sink, in a thermal path from the second surface to the heat sink. The thermal path to the support provides a first thermal resistance, based on a gap spacing of the first gap and the thermal path to the heat sink provides a second thermal resistance, based on a gap spacing of the second gap.