Compost leveling apparatus

A mushroom compost leveling apparatus includes a panel with a bottom edge where the panel is vertically suspended in a mushroom compost receptacle leaving a gap between the bottom edge and the floor of the receptacle. The panel reciprocates from side to side as mushroom compost is conveyed under the panel. Optionally, the panel includes vanes extending outwardly from a first face surface, and a rake outwardly and downwardly extending from the panel at or near the bottom edge. Optionally, a pair of wheels are mounted for rotation either to the first face of the panel or to a rail of a frame to be isolated from the panel, and the wheels each include paddles that push compost toward the side edges of the mushroom compost receptacle as the wheels are rotated. Optionally, the leveling apparatus is removably attached to sleeves depending over sidewalls of the compost receptacle, and a roller assembly is removably attached to such sleeves downstream of the leveling apparatus.