Semiconductor device and manufacturing method thereof
A semiconductor device includes a substrate, a first source/drain feature, a second source/drain feature and a dielectric plug. The substrate has a semiconductor fin. The first source/drain feature is embedded in the semiconductor fin. The second source/drain feature is embedded in the semiconductor...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A semiconductor device includes a substrate, a first source/drain feature, a second source/drain feature and a dielectric plug. The substrate has a semiconductor fin. The first source/drain feature is embedded in the semiconductor fin. The second source/drain feature is embedded in the semiconductor fin. The dielectric plug extends from above the semiconductor fin into the semiconductor fin. The dielectric plug is in between the first source/drain feature and the second source/drain feature. The dielectric plug is separated from the first source/drain feature and the second source/drain feature. |
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