Preparation of a component for use in a joint

A joint including: a first component and a second component; the first component includes a bond region and an array of projections extending from the bond region, wherein the projections are embedded in the second component.

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Bibliographische Detailangaben
Hauptverfasser:	Meyer, Jonathan, Johns, Daniel, Henstridge, Andrew
Format:	Patent
Sprache:	eng
Schlagworte:	ADDITIVE MANUFACTURING TECHNOLOGY ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BLASTING CASTING CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS ORMACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS,CLIPS, WEDGES, JOINTS OR JOINTING DYES ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING LIGHTING MACHINE TOOLS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MECHANICAL ENGINEERING METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES POWDER METALLURGY SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SOLDERING OR UNSOLDERING THERMAL INSULATION IN GENERAL TRANSPORTING USE OF MATERIALS AS ADHESIVES WEAPONS WELDING WORKING BY LASER BEAM WORKING METALLIC POWDER WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A joint including: a first component and a second component; the first component includes a bond region and an array of projections extending from the bond region, wherein the projections are embedded in the second component.