Laminated, leak-resistant chemical processors, methods of making, and methods of operating

The invention provides methods of making laminated devices (especially microchannel devices) in which plates are assembled and welded together. Unlike conventional microchannel devices, the inventive laminated devices can be made without brazing or diffusion bonding; thus providing significant advan...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Neagle, Paul W, Tonkovich, Anna Lee, Marco, Jeffrey D, Keyes, Lane W, Marchiando, Michael A, Marco, Jennifer L, Deshmukh, Soumitra, Luzenski, Robert J, Yuschak, Thomas
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CRACKING HYDROCARBON OILS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FUELS LUBRICANTS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL WAXES PEAT PERFORMING OPERATIONS PETROLEUM, GAS OR COKE INDUSTRIES PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PRODUCTION OF LIQUID HYDROCARBON MIXTURES, e.g. BY DESTRUCTIVEHYDROGENATION, OLIGOMERISATION, POLYMERISATION RECOVERY OF HYDROCARBON OILS FROM OIL-SHALE, OIL-SAND, ORGASES REFINING MIXTURES MAINLY CONSISTING OF HYDROCARBONS REFORMING OF NAPHTHA SOLDERING OR UNSOLDERING TECHNICAL GASES CONTAINING CARBON MONOXIDE THEIR RELEVANT APPARATUS TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention provides methods of making laminated devices (especially microchannel devices) in which plates are assembled and welded together. Unlike conventional microchannel devices, the inventive laminated devices can be made without brazing or diffusion bonding; thus providing significant advantages for manufacturing. Features such as expansion joints and external welded supports are also described. Laminated devices and methods of conducting unit operations in laminated devices are also described.