Electronic assembly group and method for producing the same

An electronic assembly group comprising a printed circuit board structure in a multilayer configuration that has at least two electrically conductive layers. The electronic assembly group also comprises an additional passive component that is connected to the two electrically conductive layers, each...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Gottwald, Thomas, Rössle, Christian
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER DYNAMO-ELECTRIC MACHINES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An electronic assembly group comprising a printed circuit board structure in a multilayer configuration that has at least two electrically conductive layers. The electronic assembly group also comprises an additional passive component that is connected to the two electrically conductive layers, each of which has at least one segment that extends beyond the multilayer structure to form connection regions, the passive component making contact directly at the connection regions.