Power heat dissipation device

A power heat dissipation device includes a heat-conducting layer, a heat sink and at least one cooling chip. The heat-conducting layer has a heat-absorbing surface and a heat-dissipating surface. The heat sink is in thermal contact with the heat-dissipating surface, and a heat-conducting section is...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Lin, Li-Song, Wu, Min-Chuan, Chang, Po-Hua, Chiang, Wen-Shu, Lin, Kou-Tzeng
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!