Power heat dissipation device

A power heat dissipation device includes a heat-conducting layer, a heat sink and at least one cooling chip. The heat-conducting layer has a heat-absorbing surface and a heat-dissipating surface. The heat sink is in thermal contact with the heat-dissipating surface, and a heat-conducting section is...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Lin, Li-Song, Wu, Min-Chuan, Chang, Po-Hua, Chiang, Wen-Shu, Lin, Kou-Tzeng
Format:	Patent
Sprache:	eng
Schlagworte:	ARRANGEMENTS OR ADAPTATIONS OF HEATING, COOLING, VENTILATING,OR OTHER AIR-TREATING DEVICES SPECIALLY FOR PASSENGER OR GOODSSPACES OF VEHICLES BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING VEHICLES IN GENERAL
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Beschreibung
Zusammenfassung:	A power heat dissipation device includes a heat-conducting layer, a heat sink and at least one cooling chip. The heat-conducting layer has a heat-absorbing surface and a heat-dissipating surface. The heat sink is in thermal contact with the heat-dissipating surface, and a heat-conducting section is formed in the heat sink. The cooling chip is embedded in the heat sink and disposed adjacent to the heat transferring channel. The cooling chip has a cooling surface which is perpendicular to the heat-absorbing surface. The cooling surface faces the heat transferring channel. The cooling chip removes heat from the heat-conducting section in the heat sink.