Active matrix substrate and manufacturing method of the same

The present disclosure relates to a method for manufacturing an active matrix substrate. A first laminated film in which a semiconductor film, a first transparent conductive film, and a first metal film are laminated is formed on a substrate. A photoresist pattern having a first part covering a form...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Nagayama, Kensuke, Ito, Yasuyoshi, Tsumura, Naoki, Ishiga, Nobuaki, Inoue, Kazunori
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present disclosure relates to a method for manufacturing an active matrix substrate. A first laminated film in which a semiconductor film, a first transparent conductive film, and a first metal film are laminated is formed on a substrate. A photoresist pattern having a first part covering a formation area of a channel part of a thin film transistor, a second part covering a formation area of a pixel electrode, and a third part covering formation areas of a source electrode, a drain electrode, and a source line, is formed on the first laminated film. The first metal film, the first transparent conductive film, and the semiconductor film are patterned using the photoresist pattern; the first part is removed and the first metal film and the first transparent conductive film are patterned; and the second part is removed and the first metal film is patterned.