Fluid feed slot for fluid ejection device

A method of forming a substrate for a fluid ejection device includes forming an opening in the substrate from a second side toward a first side, and further forming the opening in the substrate to the first side, including increasing the opening to the first side and increasing the opening at the se...

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Bibliographische Detailangaben
Hauptverfasser:	Ronk, Kelly, Rivas, Rio, Friesen, Ed
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CORRECTION OF TYPOGRAPHICAL ERRORS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS SOLDERING OR UNSOLDERING STAMPS TRANSPORTING TYPEWRITERS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A method of forming a substrate for a fluid ejection device includes forming an opening in the substrate from a second side toward a first side, and further forming the opening in the substrate to the first side, including increasing the opening to the first side and increasing the opening at the second side, and forming the opening with substantially parallel sidewalls intermediate the first side and the second side and converging sidewalls to the first side.