Polishing head, CMP apparatus having polishing head, and semiconductor integrated circuit manufacturing method using CMP apparatus

Polishing head, CMP apparatus having polishing head, and semiconductor integrated circuit manufacturing method using CMP apparatus

A polishing head of a CMP apparatus includes a polishing pad, an air bag brought into contact with a rear surface of a wafer on the polishing pad and configured to press a front surface of the wafer against the polishing pad, and a top ring surrounding the air bag and the wafer. A portion of the air...

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1. Verfasser: Yamamoto, Sukehiro
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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creator Yamamoto, Sukehiro
description A polishing head of a CMP apparatus includes a polishing pad, an air bag brought into contact with a rear surface of a wafer on the polishing pad and configured to press a front surface of the wafer against the polishing pad, and a top ring surrounding the air bag and the wafer. A portion of the air bag brought into contact with a peripheral portion of the wafer is thicker in film thickness than a portion of the air bag brought into contact with a central portion of the wafer. The polishing head is capable of applying even pressure to press down the wafer evenly throughout the entire wafer plane to improve the evenness of polishing.
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subjects BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
title Polishing head, CMP apparatus having polishing head, and semiconductor integrated circuit manufacturing method using CMP apparatus
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