Polishing head, CMP apparatus having polishing head, and semiconductor integrated circuit manufacturing method using CMP apparatus

A polishing head of a CMP apparatus includes a polishing pad, an air bag brought into contact with a rear surface of a wafer on the polishing pad and configured to press a front surface of the wafer against the polishing pad, and a top ring surrounding the air bag and the wafer. A portion of the air...

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Bibliographische Detailangaben
1. Verfasser:	Yamamoto, Sukehiro
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A polishing head of a CMP apparatus includes a polishing pad, an air bag brought into contact with a rear surface of a wafer on the polishing pad and configured to press a front surface of the wafer against the polishing pad, and a top ring surrounding the air bag and the wafer. A portion of the air bag brought into contact with a peripheral portion of the wafer is thicker in film thickness than a portion of the air bag brought into contact with a central portion of the wafer. The polishing head is capable of applying even pressure to press down the wafer evenly throughout the entire wafer plane to improve the evenness of polishing.