Electronic module

An electronic module is provided, which includes a first package and a second package stacked on the first package. The first package has an encapsulant and an electronic element embedded in the encapsulant. The second package has an insulating layer and an antenna structure formed on and extending...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Jiang, Don-Son, Chang, Yueh-Chiung, Hu, Shao-Chueh
Format:	Patent
Sprache:	eng
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An electronic module is provided, which includes a first package and a second package stacked on the first package. The first package has an encapsulant and an electronic element embedded in the encapsulant. The second package has an insulating layer and an antenna structure formed on and extending through the insulating layer. The insulating layer is bonded to the encapsulant with the antenna structure being electrically connected to the electronic element. Since the second package having the antenna structure is stacked on the first package, the invention eliminates the need to increase the area of the first package for mounting the antenna structure and hence allows the electronic module to meet the miniaturization requirement.