Method for manufacturing wafer-level semiconductor packages

During the manufacture of a semiconductor package, a semiconductor wafer including a plurality of bond pads on a surface of the wafer is provided and the surface of the wafer is covered with a dielectric material to form a dielectric layer over the bond pads. Portions of the dielectric layer corresp...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Fan, Chun Ho, Kuah, Teng Hock
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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