Integrated circuit packaging system with substrate and method of manufacture thereof

Integrated circuit packaging system with substrate and method of manufacture thereof

An integrated circuit packaging system, and a method of manufacture thereof, including: a substrate including: a first trace layer, an encapsulation on the first trace layer, the first trace layer having a surface exposed from the encapsulation with a rough texture characteristic of removal of a con...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Foh, Bartholomew Liao Chung, Lee, Soo Won, Punzalan, Jeffrey David, Chai, SeungYong, Szeto, Kwok Keung, Do, Byung Tai, Kim, KyungOe, Kim, Kyung Moon, Cuong, Dao Nguyen Phu
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An integrated circuit packaging system, and a method of manufacture thereof, including: a substrate including: a first trace layer, an encapsulation on the first trace layer, the first trace layer having a surface exposed from the encapsulation with a rough texture characteristic of removal of a conductive carrier coating, a second trace layer on the encapsulation and over the first trace layer, the second trace layer connected to the first trace layer; and an integrated circuit die attached to the substrate.