Minimization of ring erosion during plasma processes

Methods are disclosed for etching a substrate. The method includes preferentially coating cover ring relative other chamber components in the processing chamber, while under vacuum, and while a substrate is not present in the processing chamber. The substrate is subsequently etched the processing ch...

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Bibliographische Detailangaben
Hauptverfasser: Joubert, Olivier, Achutharaman, Vedapuram S, Luere, Olivier
Format: Patent
Sprache:eng
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