Method of manufacturing printed circuit board

A step of forming bump pads on the surface of the substrate corresponding to the cavity region, and covering the whole surface with a second insulating layer, forming a copper barrier on the surface of a second insulating layer corresponding to the cavity region for protection of the second insulati...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Ko, Young-Joo, Ko, Tae-Hyuk, Lee, Hyeung-Do
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A step of forming bump pads on the surface of the substrate corresponding to the cavity region, and covering the whole surface with a second insulating layer, forming a copper barrier on the surface of a second insulating layer corresponding to the cavity region for protection of the second insulating layer, forming a third insulating layer, and forming a copper layer for electrical circuit. A mask is formed on the copper later of the external circuit so that only the cavity region is exposed. The cavity is formed by laser-drilling only the surface-exposed area of the third insulating layer. The bottom copper layer protects the second insulating layer and bump pads underneath from laser damages. The copper barrier is removed by chemical etch after the laser drill. The second insulating layer with the bottom surface exposed will be removed via sand blast process, exposing the bump pads fabricated.