Thermal management systems, methods for making, and methods for using

Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide thermal management or cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins. Other embodiments of the invention are directed to heat spreaders (e.g. heat pipes or vapor chambers) that provide enhanced thermal management via enhanced wicking structures and/or vapor creation and flow structures. Other embodiments provide enhanced methods for making such arrays and spreaders.