Adhesive including ethylene⋅α-olefin copolymer

An adhesive with improved heat stability is provided. The adhesive includes an ethylene⋅α-olefin copolymer (A) having a number-average molecular weight of 5000 to 100000 in terms of polystyrene as measured by gel permeation chromatography and a density of 860 to 970 kg/m3, wherein in the ethylene⋅α-...

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Bibliographische Detailangaben
Hauptverfasser:	Nakano, Hidetake, Yoshimoto, Koya, Yamaguchi, Masayoshi
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	An adhesive with improved heat stability is provided. The adhesive includes an ethylene⋅α-olefin copolymer (A) having a number-average molecular weight of 5000 to 100000 in terms of polystyrene as measured by gel permeation chromatography and a density of 860 to 970 kg/m3, wherein in the ethylene⋅α-olefin copolymer (A), the total number of vinyl-type double bond, vinylidene-type double bond, 2-substituted olefin-type double bond and 3-substituted olefin-type double bond is less than 0.5 per 1000 carbon atoms as measured by 1H-NMR.