Flexible, hermetic electrical interconnect for electronic and optoelectronic devices for in vivo use

An electronic device can comprise a first electronic module; a second electronic module; and a hermetic electric interconnect to hermetically couple them. The hermetic electric interconnect can comprise a bottom metal layer; a bottom insulating layer, deposited on the bottom metal layer to insulate...

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Bibliographische Detailangaben
Hauptverfasser:	Mattes, Michael F, Zielke, Mark A
Format:	Patent
Sprache:	eng
Schlagworte:	BANDAGES, DRESSINGS OR ABSORBENT PADS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONTACT LENSES DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF,TUBULAR STRUCTURES OF THE BODY, E.G. STENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROTHERAPY FILTERS IMPLANTABLE INTO BLOOD VESSELS FIRST-AID KITS FOMENTATION HUMAN NECESSITIES HYGIENE MAGNETOTHERAPY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEDICAL OR VETERINARY SCIENCE OPTICS ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES PERFORMING OPERATIONS PHYSICS PRINTED CIRCUITS PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE PROSTHESES RADIATION THERAPY SEMICONDUCTOR DEVICES SPECTACLES SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURESAS SPECTACLES TRANSPORTING TREATMENT OR PROTECTION OF EYES OR EARS ULTRASOUND THERAPY WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	An electronic device can comprise a first electronic module; a second electronic module; and a hermetic electric interconnect to hermetically couple them. The hermetic electric interconnect can comprise a bottom metal layer; a bottom insulating layer, deposited on the bottom metal layer to insulate the bottom metal layer; an interconnect metal layer, deposited on the bottom insulating layer, and deposited to form a bottom sealing ring; and patterned to form electrical connections between contact pads, and to form a middle sealing ring; a patterned top insulating layer, deposited on the interconnect metal layer to insulate the interconnect metal layer; and patterned to form feedthrough holes; and a top metal layer, deposited on the top insulating layer to start forming contacts by filling the feedthrough holes; and patterned to complete forming contacts through the feedthrough holes, to form a separate barrier layer, and to complete forming the top sealing ring.