Selective processing of a workpiece

Methods for the selective processing of the outer portion of a workpiece are disclosed. The outer portion is processed by directing an ion beam toward the workpiece, where the ion beam extends beyond the outer edge of the workpiece at two locations. The workpiece is then rotated relative to the ion...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Todorov, Stanislav S, Evans, Morgan D, Lee, William Davis, Amato, Mark R, Reno, Jillian, Distaso, Daniel
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Methods for the selective processing of the outer portion of a workpiece are disclosed. The outer portion is processed by directing an ion beam toward the workpiece, where the ion beam extends beyond the outer edge of the workpiece at two locations. The workpiece is then rotated relative to the ion beam about the center so that all regions of the outer portion are exposed to the ion beam. The workpiece may be rotated an integral number of rotations. The ion beam may perform any process, such as ion implantation, etching or deposition. The outer portion may be an annular ring having an outer diameter equal to that of the workpiece and having a width of 1 to 30 millimeters. The rotation of the workpiece may be aligned with a notch on the outer edge of the workpiece.