Waveguide structures used in phonotics chip packaging

The disclosure relates to semiconductor structures and, more particularly, to waveguide structures used in phonotics chip packaging and methods of manufacture. The structure includes: a first die comprising photonics functions including a waveguide structure; a second die bonded to the first die and...

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Hauptverfasser:	Adderly, Shawn A, Letourneau, Donald R, DiStefano, Samantha D, Gambino, Jeffrey P, Periasamy, Prakash
Format:	Patent
Sprache:	eng
Schlagworte:	OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS
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creator	Adderly, Shawn A Letourneau, Donald R DiStefano, Samantha D Gambino, Jeffrey P Periasamy, Prakash
description	The disclosure relates to semiconductor structures and, more particularly, to waveguide structures used in phonotics chip packaging and methods of manufacture. The structure includes: a first die comprising photonics functions including a waveguide structure; a second die bonded to the first die and comprising CMOS logic functions; and an optical fiber optically coupled to the waveguide structure and positioned within a cavity formed in the second die.
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title	Waveguide structures used in phonotics chip packaging
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