Waveguide structures used in phonotics chip packaging
The disclosure relates to semiconductor structures and, more particularly, to waveguide structures used in phonotics chip packaging and methods of manufacture. The structure includes: a first die comprising photonics functions including a waveguide structure; a second die bonded to the first die and...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The disclosure relates to semiconductor structures and, more particularly, to waveguide structures used in phonotics chip packaging and methods of manufacture. The structure includes: a first die comprising photonics functions including a waveguide structure; a second die bonded to the first die and comprising CMOS logic functions; and an optical fiber optically coupled to the waveguide structure and positioned within a cavity formed in the second die. |
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