High-frequency module

A high-frequency module includes a wiring substrate, a high-frequency circuit including circuit components disposed on the upper surface of the wiring substrate, a post made of metal and disposed on the upper surface of the wiring substrate, a sealing resin covering the circuit components, and an an...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Nakagawa, Masashi, Kai, Shoji, Shibuya, Yoshihisa, Kuwana, Shunji, Watanabe, Hideki
Format:	Patent
Sprache:	eng
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A high-frequency module includes a wiring substrate, a high-frequency circuit including circuit components disposed on the upper surface of the wiring substrate, a post made of metal and disposed on the upper surface of the wiring substrate, a sealing resin covering the circuit components, and an antenna substrate disposed on the upper surface of the sealing resin and having an antenna formed by a metal pattern. A groove is provided on the sealing resin, at least a part of the post is exposed from the groove, a central surface and two opposing side wall surfaces located higher than the central surface are formed at the upper side of the post, and a conductive adhesive is bonded to the central surface, the two side wall surfaces, and the antenna.