Immersion de-taping

Embodiments using immersion de-taping are described. A substrate having a substrate tape attached thereto is provided. The substrate includes electrically conductive connectors attached to the substrate tape. A fluid is provided between the substrate and the substrate tape. While the fluid is betwee...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Li, Chien-Chen, Lu, Kuo Liang, Liu, Te Lung, Chang, Fu-Chen, Liu, Ching Tasi
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Embodiments using immersion de-taping are described. A substrate having a substrate tape attached thereto is provided. The substrate includes electrically conductive connectors attached to the substrate tape. A fluid is provided between the substrate and the substrate tape. While the fluid is between the substrate and the substrate tape, the substrate tape is removed from the substrate. Another embodiment is an apparatus comprising an immersion tank, a substrate chuck, first and second fixed rollers, and a moveable roller. The substrate chuck is configured to secure a substrate and to place the substrate into the immersion tank. The first fixed roller is operable to dispense a clamp tape. The second fixed roller is operable to roll the clamp tape. The moveable roller is operable to extend into the immersion tank and to adhere the clamp tape to a substrate tape on the substrate.