Cylinder plating apparatus and method

Provided are a cylinder plating apparatus and a cylinder plating method, in which the distance between an insoluble electrode and a cylinder to be processed can be kept constant regardless of the diameter of the cylinder to be processed, and the surface area of the insoluble electrode is increased to reduce the current density of the insoluble electrode, thereby being capable of reducing burden on the insoluble electrode. The cylinder plating apparatus is configured to plate an outer peripheral surface of the cylinder to be processed in such a manner that a pair of the insoluble electrodes each having a shape in which at least a lower part thereof is curved inward and being constructed such that at least the lower part has a comb-like portion are brought close to both side surfaces of the cylinder to be processed with predetermined intervals. The insoluble electrodes face each other in a staggered pattern so that projections of the comb-like portion of one of the insoluble electrodes are located at positions of recesses of the comb-like portion of another one of the insoluble electrodes. The insoluble electrode is configured to rotate about an upper end of the insoluble electrode so that the distance of closeness of the insoluble electrode to the outer peripheral surface of the cylinder to be processed is adjustable depending on the diameter of the cylinder to be processed.