Method for analyzing stress in an object

A method for analyzing stress in an object according to spectrum data is provided. The spectrum data is obtained from an interference fringe pattern of the object that results from performing photoelasticity. The method includes: analyzing the spectrum data to obtain three sets of intensity data rel...

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Bibliographische Detailangaben
Hauptverfasser:	Chiang, Yu-An, Hung, Te-Heng, Sung, Po-Chi, Wang, Wei-Chung
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING MEASURING MEASURING ANGLES MEASURING AREAS MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS TESTING
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Beschreibung
Zusammenfassung:	A method for analyzing stress in an object according to spectrum data is provided. The spectrum data is obtained from an interference fringe pattern of the object that results from performing photoelasticity. The method includes: analyzing the spectrum data to obtain three sets of intensity data related respectively to different wavelengths of light used in photoelasticity; calculating wrapped phases according to the three sets of intensity data, respectively; calculating preliminary stress values according to the wrapped phases, respectively; determining a system of stress equations according to a relation among the preliminary stress values; and calculating an estimated stress value using the system of stress equations.