Semiconductor device having field insulation layer between two fins

Semiconductor devices are provided. The semiconductor device includes a first fin and a second fin on a substrate and a field insulation layer between the first fin and the second fin. The field insulation layer include a first insulation layer and a second insulation layer on the first insulation l...

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Bibliographische Detailangaben
Hauptverfasser: Gwon, Mi Gyeong, Min, Kyung Seok, Sung, Sug Hyun, Oh, Young Mook, Song, Young Hoon, Nam, Seong Jin
Format: Patent
Sprache:eng
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Zusammenfassung:Semiconductor devices are provided. The semiconductor device includes a first fin and a second fin on a substrate and a field insulation layer between the first fin and the second fin. The field insulation layer include a first insulation layer and a second insulation layer on the first insulation layer and connected to the first insulation layer. The second insulation layer is wider than the first insulation layer. A ratio of a top width to a bottom width of each of the first fin and the second fin exceeds 0.5.