Method for laser annealing with laser beam radiated via through hole
A laser annealing method that includes forming a second layer having through holes on a first layer, and radiating laser light with a wavelength of 3 μm or greater to the first layer via the through holes.
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A laser annealing method that includes forming a second layer having through holes on a first layer, and radiating laser light with a wavelength of 3 μm or greater to the first layer via the through holes. |
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