Electrodeposition of metal microstructures

In one embodiment, a method for fabricating a metal microstructure includes forming a non-conductive polymer membrane having a plurality of pores, coating at least one end of the membrane and inner surfaces of the pores with a conductive material to form a conductive coating, electrodepositing a met...

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Bibliographische Detailangaben
Hauptverfasser:	Cai, Wenjun, Mraied, Hesham Y. Saleh
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FERROUS OR NON-FERROUS ALLOYS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	In one embodiment, a method for fabricating a metal microstructure includes forming a non-conductive polymer membrane having a plurality of pores, coating at least one end of the membrane and inner surfaces of the pores with a conductive material to form a conductive coating, electrodepositing a metal on the conductive coating, and dissolving the membrane to obtain a free-standing metal microstructure having at least one metal end plate and multiple elongated metal members extending therefrom.