Silver sintering compositions with fluxing or reducing agents for metal adhesion

A conductive composition that is sinterable comprises (i) micron- or submicron-sized silver flakes or powders and (ii) a fluxing agent, or an oxygenated solvent, or a peroxide. The composition can be used to adhere semiconductor dies with silver backing to copper-, silver-, or gold lead-frames at si...

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Bibliographische Detailangaben
Hauptverfasser:	Sanchez, Juliet Grace, Kuder, Harry Richard
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CONDUCTORS CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	A conductive composition that is sinterable comprises (i) micron- or submicron-sized silver flakes or powders and (ii) a fluxing agent, or an oxygenated solvent, or a peroxide. The composition can be used to adhere semiconductor dies with silver backing to copper-, silver-, or gold lead-frames at sintering temperatures of ≤250° C. without the application of pressure.