METHOD FOR MANUFACTURING GALVANOPLASTIC PRODUCTS, IN PARTICULAR THIN COPPER FOIL FOR PRINTED CIRCUIT CARDS

METHOD FOR MANUFACTURING GALVANOPLASTIC PRODUCTS, IN PARTICULAR THIN COPPER FOIL FOR PRINTED CIRCUIT CARDS

A method for manufacturing the galvanoplastic products, in particular the thin copper foil for the printed circuit cards comprises the plasmachemical coating of the cathodic base with titanium nitride layer, 0.1-1.0 mm in thickness followed by electric precipitation of the metal layer.

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Hauptverfasser: TROTSENKO VLADYSLAV IVANOVYCH, ROZMOLOHOV VALERII LEONIDOVYCH, DRON'' MYKOLA MYKHAILOVYCH
Format: Patent
Sprache:eng
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APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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creator TROTSENKO VLADYSLAV IVANOVYCH
ROZMOLOHOV VALERII LEONIDOVYCH
DRON'' MYKOLA MYKHAILOVYCH
description A method for manufacturing the galvanoplastic products, in particular the thin copper foil for the printed circuit cards comprises the plasmachemical coating of the cathodic base with titanium nitride layer, 0.1-1.0 mm in thickness followed by electric precipitation of the metal layer.
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subjects APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title METHOD FOR MANUFACTURING GALVANOPLASTIC PRODUCTS, IN PARTICULAR THIN COPPER FOIL FOR PRINTED CIRCUIT CARDS
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