METHOD FOR MANUFACTURING GALVANOPLASTIC PRODUCTS, IN PARTICULAR THIN COPPER FOIL FOR PRINTED CIRCUIT CARDS

METHOD FOR MANUFACTURING GALVANOPLASTIC PRODUCTS, IN PARTICULAR THIN COPPER FOIL FOR PRINTED CIRCUIT CARDS

A method for manufacturing the galvanoplastic products, in particular the thin copper foil for the printed circuit cards comprises the plasmachemical coating of the cathodic base with titanium nitride layer, 0.1-1.0 mm in thickness followed by electric precipitation of the metal layer.

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TROTSENKO VLADYSLAV IVANOVYCH, ROZMOLOHOV VALERII LEONIDOVYCH, DRON'' MYKOLA MYKHAILOVYCH
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A method for manufacturing the galvanoplastic products, in particular the thin copper foil for the printed circuit cards comprises the plasmachemical coating of the cathodic base with titanium nitride layer, 0.1-1.0 mm in thickness followed by electric precipitation of the metal layer.