ADHESIVE COMPOSITION ôSAPPHIREö

An adhesive composition based on epoxy-silicon resin, polyamide and powder filling agent. As powder filling agent the powder with grain size of 10-15 nm is used.

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Bibliographische Detailangaben
Hauptverfasser:	VENGER YEVGEN FEDOROVYCH, LOKSHYN MYKHAILO MARKOVYCH, MASLOV VOLODYMYR PETROVYCH
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	An adhesive composition based on epoxy-silicon resin, polyamide and powder filling agent. As powder filling agent the powder with grain size of 10-15 nm is used.