FLUX FOR LOW-TEMPERATURE SOLDERING

A flux for low-temperature soldering contains maleic acid, formamide, ethylene glycol and water.

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Bibliographische Detailangaben
Hauptverfasser:	BUHAIOVA TETIANA MYKOLAIVNA, LAVENOVA TETIANA IVANIVNA, KURMASHEV SHAMIL DZHAMASHEVYCH
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A flux for low-temperature soldering contains maleic acid, formamide, ethylene glycol and water.