Interface card device and its heat dissipation module

An interface card device includes an interface card unit, a heat dissipation module and a thermal pad. The interface card unit includes a circuit board and a heat-generating element mounted on one surface of the circuit board. The heat dissipation module includes a heat dissipation block and a conca...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SU, CHIENIH, YU, HSING-PAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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