Interface card device and its heat dissipation module
An interface card device includes an interface card unit, a heat dissipation module and a thermal pad. The interface card unit includes a circuit board and a heat-generating element mounted on one surface of the circuit board. The heat dissipation module includes a heat dissipation block and a conca...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | An interface card device includes an interface card unit, a heat dissipation module and a thermal pad. The interface card unit includes a circuit board and a heat-generating element mounted on one surface of the circuit board. The heat dissipation module includes a heat dissipation block and a concave-convex pattern structure. The heat dissipation block is combined with the circuit board, and the concave-convex pattern structure is protrusively disposed on one surface of the heat dissipation block facing towards the circuit board. The thermal pad is flexible, directly sandwiched between the concave-convex pattern structure and the heat-generating element, and thermally connected to the heat dissipation block and the heat-generating element. |
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