Heat dissipation shielding component and wireless communication device

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Hauptverfasser:	HUANG, SHENG-YANG, LO, WEING, KUANG, CHUNG-YUAN, LIAO, KUOU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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creator	HUANG, SHENG-YANG LO, WEING KUANG, CHUNG-YUAN LIAO, KUOU
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title	Heat dissipation shielding component and wireless communication device
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