Wafer holder for lapping device

A wafer holder for lapping device includes a carrier with at least one holding hole; a digital code area is arranged on the carrier and located outside the holding hole area; wherein the carrier is an opaque polymer which is benefit for reading the code on the digital code area with light.

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Bibliographische Detailangaben
Hauptverfasser:	CHENG, CHUNUNG, HSU, PEIING, YANG, FUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	A wafer holder for lapping device includes a carrier with at least one holding hole; a digital code area is arranged on the carrier and located outside the holding hole area; wherein the carrier is an opaque polymer which is benefit for reading the code on the digital code area with light.